US 12,317,638 B2
Sensor packages with wavelength-specific light filters
Jo Bito, Dallas, TX (US); and Benjamin Stassen Cook, Los Gatos, CA (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Jan. 28, 2021, as Appl. No. 17/161,581.
Prior Publication US 2022/0238733 A1, Jul. 28, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H10F 77/30 (2025.01); H10F 77/50 (2025.01)
CPC H10F 77/331 (2025.01) [H01L 23/293 (2013.01); H01L 23/31 (2013.01); H01L 24/14 (2013.01); H10F 77/50 (2025.01)] 25 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a semiconductor die having a first surface and opposing second and third surfaces on two sides of the first surface, the semiconductor die including
first and second light sensors on the first surface of the semiconductor die;
a mold compound covering at least parts of the second and third surfaces and at least a part of the first surface, the mold compound including first cavity and a second cavity, in which the first cavity over the first light sensor, the second cavity is over the second light sensor, and each of the first and second cavities has a rectangular shape in a plane parallel to the first surface;
a first light filter in the first cavity; and
a second light filter in the second cavity, the second light filter having a different optical property from the first light filter.