US 12,317,633 B2
Radiation hardened infrared focal plane array
Yong Chang, Naperville, IL (US); Silviu Velicu, Willowbrook, IL (US); and Sushant Sonde, Westmont, IL (US)
Assigned to EPIR, INC., Bolingbrook, IL (US)
Filed by Yong Chang, Naperville, IL (US); Silviu Velicu, Willowbrook, IL (US); and Sushant Sonde, Westmont, IL (US)
Filed on Jun. 24, 2022, as Appl. No. 17/848,911.
Claims priority of provisional application 63/214,556, filed on Jun. 24, 2021.
Prior Publication US 2023/0008594 A1, Jan. 12, 2023
Int. Cl. H01L 31/0352 (2006.01); H01L 23/00 (2006.01); H01L 31/02 (2006.01); H01L 31/0216 (2014.01); H01L 31/0224 (2006.01); H10F 77/00 (2025.01); H10F 77/14 (2025.01); H10F 77/20 (2025.01); H10F 77/30 (2025.01)
CPC H10F 77/14 (2025.01) [H01L 24/05 (2013.01); H01L 24/13 (2013.01); H10F 77/20 (2025.01); H10F 77/30 (2025.01); H10F 77/93 (2025.01); H01L 2224/05548 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13109 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A pixel for an FPA comprising:
a substrate;
a plurality of spaced-apart implant regions deposited in the substrate;
a plurality of spaced-apart metal contacts, one spaced-apart metal contact of the plurality of spaced-apart metal contacts electrically connected to one implant region of the plurality of implant regions;
a plurality of metal conductors, one metal conductor of the plurality of metal conductors electrically connected to two spaced-apart metal contacts of the plurality of spaced-apart metal contacts;
a central metal contact, electrically connected to the plurality of spaced-apart metal contacts by at least one of the metal conductor of the plurality of metal conductors; and
an Indium bump electrically connected to the central metal contact.