| CPC H10F 39/811 (2025.01) [H10F 39/011 (2025.01); H10F 39/18 (2025.01); H10F 39/804 (2025.01); H10F 39/8063 (2025.01)] | 21 Claims |
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1. A package comprising:
a substrate made of a stack of dielectric insulating material layers interleaved with conductive layers, the substrate including a first cavity at a first vertical height from a bottom surface of the substrate and a second cavity at a second vertical height greater than the first vertical height from the bottom surface of the substrate, wherein a sidewall of the first cavity includes a sub stack of the stack of dielectric insulating material layers interleaved with the conductive layers;
an integrated circuit die disposed in the first cavity;
a digital image sensor die disposed in the second cavity; and
a transparent cover disposed at a top of the substrate over the second cavity.
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