US 12,317,623 B2
Imaging apparatus, manufacturing method thereof, and electronic equipment
Nao Yoshimoto, Kanagawa (JP); Yuki Miyanami, Kanagawa (JP); and Shigehiro Ikehara, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/756,358
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Dec. 1, 2020, PCT No. PCT/JP2020/044739
§ 371(c)(1), (2) Date May 23, 2022,
PCT Pub. No. WO2021/112098, PCT Pub. Date Jun. 10, 2021.
Claims priority of application No. 2019-218336 (JP), filed on Dec. 2, 2019.
Prior Publication US 2023/0005978 A1, Jan. 5, 2023
Int. Cl. H10F 39/00 (2025.01); H10F 39/18 (2025.01)
CPC H10F 39/8057 (2025.01) [H10F 39/024 (2025.01); H10F 39/8033 (2025.01); H10F 39/18 (2025.01)] 22 Claims
OG exemplary drawing
 
1. An imaging apparatus comprising:
a semiconductor substrate;
a photoelectric conversion unit that is provided on the semiconductor substrate and generates electrical charge in accordance with an amount of received light through photoelectric conversion;
an electrical charge holding unit that is disposed on a side closer to a first surface of the semiconductor substrate than the photoelectric conversion unit and holds the electrical charge transferred from the photoelectric conversion unit;
an electrical charge transfer unit that transfers the electrical charge from the photoelectric conversion unit to the electrical charge holding unit;
a vertical electrode that transmits the electrical charge generated by the photoelectric conversion unit to the electrical charge transfer unit and is disposed in a depth direction of the semiconductor substrate; and
a first light control member that is disposed on a side closer to a second surface that is a side opposite to the first surface of the semiconductor substrate than the vertical electrode, wherein
the first light control member includes a first light control portion and a second light control portion extending in mutually intersecting directions in an integrated structure,
the first light control portion is disposed at a position overlapping the vertical electrode in a plan view of the semiconductor substrate from a normal line direction of the first surface, and
the second light control portion includes a first end portion connected to the first light control portion and the other a second end portion disposed in the depth direction of the semiconductor substrate from the first end portion.