US 12,317,619 B2
Solid-state imaging device and electronic device
Yoshihiro Makita, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed on Oct. 11, 2023, as Appl. No. 18/379,029.
Application 18/379,029 is a continuation of application No. 17/283,147, granted, now 11,817,467, previously published as PCT/JP2019/035824, filed on Sep. 12, 2019.
Claims priority of application No. 2018-194269 (JP), filed on Oct. 15, 2018.
Prior Publication US 2024/0038796 A1, Feb. 1, 2024
Int. Cl. H10F 39/00 (2025.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01)
CPC H10F 39/804 (2025.01) [H01L 23/13 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32237 (2013.01); H01L 2224/73204 (2013.01); H10F 39/811 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A solid-state imaging device, comprising:
an optical element having a pixel region which is a light receiving or emitting region including a large number of pixels on a surface side of a semiconductor substrate;
a substrate provided on the surface side with respect to the optical element and having an opening for passing light to be received or emitted by the pixel region; and
an underfill part covering a connection part that electrically connects the optical element and the substrate,
wherein the substrate has a groove and a flat surface on a surface portion forming the opening, and
wherein a part of the underfill part is in contact with the groove without being in contact with the flat surface.