US 12,317,617 B2
Solid-state imaging device and electronic equipment
Isao Hirota, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed on Aug. 10, 2023, as Appl. No. 18/447,882.
Application 18/447,882 is a continuation of application No. 16/732,003, filed on Dec. 31, 2019, granted, now 11,728,357.
Application 16/732,003 is a continuation of application No. 15/325,768, granted, now 10,554,874, issued on Feb. 4, 2020, previously published as PCT/JP2015/069827, filed on Jul. 10, 2015.
Claims priority of application No. 2014-148837 (JP), filed on Jul. 22, 2014.
Prior Publication US 2024/0030244 A1, Jan. 25, 2024
Int. Cl. H04N 23/67 (2023.01); G02B 7/34 (2021.01); G02B 7/38 (2021.01); G02B 13/00 (2006.01); H04N 25/704 (2023.01); H10F 39/00 (2025.01); H10F 39/12 (2025.01); H10F 39/18 (2025.01); G03B 13/36 (2021.01)
CPC H10F 39/803 (2025.01) [G02B 7/34 (2013.01); G02B 7/38 (2013.01); G02B 13/0085 (2013.01); H04N 23/672 (2023.01); H04N 23/673 (2023.01); H04N 25/704 (2023.01); H10F 39/182 (2025.01); H10F 39/191 (2025.01); H10F 39/8027 (2025.01); H10F 39/806 (2025.01); H10F 39/8063 (2025.01); G03B 13/36 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A light detecting device comprising:
an organic photoelectric conversion film;
a first semiconductor substrate including a photodiode;
a first multi-layer wiring layer;
a second semiconductor substrate including a circuit;
a second multi-layer wiring layer; and
a transparent layer between the organic photoelectric conversion film and the first semiconductor substrate;
wherein the first multi-layer wiring layer and the second multi-layer wiring layer are disposed between the first semiconductor substrate and the second semiconductor substrate, and
wherein a first wiring of the first multi-layer wiring layer and a second wiring of the second multi-layer wiring layer are bonded.