US 12,317,464 B2
Package body, preparation method thereof, terminal, and electronic device
Le Zhang, Shenzhen (CN); Xueping Guo, Shenzhen (CN); and Huijuan Wang, Shenzhen (CN)
Assigned to HONOR DEVICE CO., LTD., Shenzhen (CN)
Appl. No. 18/041,762
Filed by Honor Device Co., Ltd., Shenzhen (CN)
PCT Filed Sep. 24, 2021, PCT No. PCT/CN2021/120376
§ 371(c)(1), (2) Date Feb. 15, 2023,
PCT Pub. No. WO2022/063239, PCT Pub. Date Mar. 31, 2022.
Claims priority of application No. 202011023979.6 (CN), filed on Sep. 25, 2020.
Prior Publication US 2023/0309281 A1, Sep. 28, 2023
Int. Cl. H05K 1/02 (2006.01); H01L 21/56 (2006.01); H01L 23/10 (2006.01); H01L 23/29 (2006.01); H01L 23/552 (2006.01); H01L 23/60 (2006.01); H01L 31/0216 (2014.01); H04M 1/02 (2006.01); H04M 1/26 (2006.01); H05K 9/00 (2006.01)
CPC H05K 9/0081 (2013.01) [H04M 1/026 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A package body, comprising:
a substrate;
a plurality of electronic components, arranged on the substrate, wherein the plurality of electronic components comprises electronic components configured to emit low frequency electromagnetic waves, and a frequency of the low frequency electromagnetic waves is less than 10 MHz;
a package material layer, located on the substrate and packaging the plurality of electronic components; and
a low frequency shielding conductive structure, embedded in the package material layer,
wherein the low frequency shielding conductive structure is located on a side of the package material layer away from the substrate and is spaced apart from the plurality of electronic components,
wherein the low frequency shielding conductive structure covers at least the electronic components that are configured to emit the low frequency electromagnetic waves, and a region of the low frequency shielding conductive structure covering the electronic components that are configured to emit the low frequency electromagnetic waves is meshed,
wherein the low frequency shielding conductive structure is provided with a plurality of through holes,
wherein an area of an opening of each of at least some of the through holes is less than 1 mm*1 mm, and
wherein a thickness of the low frequency shielding conductive structure is not less than 10 μm.