| CPC H05K 3/4626 (2013.01) [H05K 1/115 (2013.01); H05K 3/462 (2013.01); H05K 2201/096 (2013.01)] | 12 Claims |
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1. A laminated wiring board comprising:
a plurality of first wiring boards laminated on one another;
a first insulating resin layer disposed between two adjacent first wiring boards among the plurality of first wiring boards; and
a second insulating resin layer configured to cover side surfaces of the plurality of first wiring boards, wherein:
each first wiring board among the plurality of first wiring boards includes a core layer having an upper surface and a lower surface, a first laminate having a plurality of interconnect layers and a plurality of insulating layers alternately laminated on the upper surface of the core, and a second laminate having a plurality of interconnect layers and a plurality of insulating layers alternately laminated on the lower surface of the core layer,
at least one interconnect layer among the plurality of interconnect layers in each of the first laminate and the second laminate includes an interconnect pattern and a via interconnect, and
interconnect patterns of the two adjacent first wiring boards are mechanically bonded via a first conductive bonding material.
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