US 12,317,424 B2
Wiring circuit board
Kenya Takimoto, Osaka (JP); Naoki Shibata, Osaka (JP); and Hayato Takakura, Osaka (JP)
Assigned to NITTO DENKO CORPORATION, Osaka (JP)
Appl. No. 17/610,058
Filed by NITTO DENKO CORPORATION, Osaka (JP)
PCT Filed Apr. 8, 2020, PCT No. PCT/JP2020/015871
§ 371(c)(1), (2) Date Nov. 9, 2021,
PCT Pub. No. WO2020/230487, PCT Pub. Date Nov. 19, 2020.
Claims priority of application No. 2019-092725 (JP), filed on May 16, 2019.
Prior Publication US 2022/0256712 A1, Aug. 11, 2022
Int. Cl. H05K 3/24 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01); H05K 3/40 (2006.01); H05K 3/44 (2006.01)
CPC H05K 3/244 (2013.01) [H05K 1/117 (2013.01); H05K 3/067 (2013.01); H05K 3/403 (2013.01); H05K 3/44 (2013.01); H05K 2203/072 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A wiring circuit board comprising:
a metal support layer,
an insulating layer disposed on one side in a thickness direction of the metal support layer, and
a conductive layer disposed on one surface in the thickness direction of the insulating layer, and including:
a ground pattern including a ground terminal and electrically connected to the metal support layer; a wiring pattern including a terminal portion and not electrically connected to the metal support layer; and
a ground lead residual portion electrically connected to the terminal portion of the wiring pattern and not connected to the ground pattern,
wherein a thickness of the ground lead residual portion is thinner than a thickness of the terminal portion.