US 12,317,419 B2
Apparatus for temperature measurement and method of processing substrate
Yong Jun Seo, Gyeonggi-do (KR); Sang Hyun Son, Busan (KR); Su Jin Chae, Gyeonggi-do (KR); and Dong Ok Ahn, Gyeonggi-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on May 5, 2022, as Appl. No. 17/737,354.
Claims priority of application No. 10-2021-0121865 (KR), filed on Sep. 13, 2021.
Prior Publication US 2023/0083574 A1, Mar. 16, 2023
Int. Cl. G01K 1/143 (2021.01); G01K 1/18 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/181 (2013.01) [G01K 1/143 (2013.01); G01K 1/18 (2013.01); H05K 1/0201 (2013.01); H05K 2201/09027 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10151 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An apparatus for measuring a temperature comprising: a test substrate having a thermal conductivity; a circuit board layer stacked on the test substrate and including a plurality of through holes exposing a top surface of the test substrate; a bonding agent disposed in the plurality of through holes and having a thermal conductivity; and a plurality of sensors disposed on the bonding agent and for measuring a temperature; wherein the circuit board layer comprises, a first annular line having a first diameter with respect to a center of the circuit board layer, a second annular line having a second diameter greater than the first diameter with respect to a center of the circuit board layer, a first straight line passing through a center of the circuit board layer, intersecting the first annular line at first and second points, and intersecting the second annular line at third and fourth points, and a second straight line intersecting the first straight line at a center of the circuit board layer, intersecting the first annular line at fifth and sixth points, and intersecting the second annular line at seventh and eighth points, wherein the plurality of through holes are disposed at the center and the first to eighth points.