US 12,317,417 B2
Connection structure and electronic device
Mei-Hsiu Pan, Miao-Li County (TW); and Mei-Chi Hsu, Miao-Li County (TW)
Assigned to INNOLUX CORPORATION, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Dec. 9, 2022, as Appl. No. 18/063,714.
Claims priority of application No. 202210017348.6 (CN), filed on Jan. 7, 2022.
Prior Publication US 2023/0225052 A1, Jul. 13, 2023
Int. Cl. H05K 1/11 (2006.01); H01L 23/522 (2006.01)
CPC H05K 1/115 (2013.01) [H01L 23/5226 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A connection structure, comprising:
a first conductive pad;
a first insulating layer disposed on the first conductive pad and comprising a first through-hole and a third through-hole;
a second conductive pad disposed on the first insulating layer and electrically connected to the first conductive pad through the first through-hole and the third through-hole;
a second insulating layer disposed on the second conductive pad and comprising a second through-hole, a first recessed portion and a second recessed portion, wherein the first recessed portion overlaps the first through-hole, and the second recessed portion overlaps the third through-hole; and
a third conductive pad disposed on the second insulating layer and electrically connected to the second conductive pad through the second through-hole,
wherein the third conductive pad extends on a surface of the first recessed portion and a surface the second recessed portion,
wherein the first conductive pad comprises two contact portions, the two contact portions do not overlap the second through-hole, the second conductive pad is in contact with one of the two contact portions through the first through-hole, and the second conductive pad is in contact with the other of the two contact portions through the third through-hole.