US 12,317,412 B2
High-frequency module and communication device
Yoichi Sawada, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Feb. 6, 2023, as Appl. No. 18/164,707.
Application 18/164,707 is a continuation of application No. PCT/JP2021/024355, filed on Jun. 28, 2021.
Claims priority of application No. 2020-146347 (JP), filed on Aug. 31, 2020.
Prior Publication US 2023/0189432 A1, Jun. 15, 2023
Int. Cl. H05K 1/02 (2006.01)
CPC H05K 1/0243 (2013.01) [H05K 1/0216 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10098 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A high-frequency module, comprising:
a first substrate having a first main surface, and a second main surface opposite to the first main surface;
one or more circuit module components disposed on the first main surface;
a first resin that covers the first main surface; and
a first metal shield layer that covers a top surface of each of the first resin and the one or more circuit module components, and that is at ground potential,
wherein each of the one or more circuit module components comprises:
a second substrate having a third main surface, and a fourth main surface opposite to the third main surface,
a first circuit component disposed on the third main surface,
one or more second circuit components disposed on the third main surface or the fourth main surface,
a second resin covering the third main surface,
a second metal shield layer covering a side surface of each of the second resin and the second substrate, and that is at ground potential, and
a third resin covering the fourth main surface,
wherein an end surface on a side of the top surface of the second metal shield layer contacts the first metal shield layer, and
wherein the second metal shield layer covers a side surface of the third resin.