US 12,316,990 B2
Imaging system with time-of-flight sensing
Erez Tadmor, Atlit (IL); and Tomas Geurts, Haasrode (BE)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed on Jul. 10, 2023, as Appl. No. 18/349,380.
Application 18/349,380 is a continuation of application No. 17/247,522, filed on Dec. 15, 2020, granted, now 11,743,616.
Claims priority of provisional application 63/015,762, filed on Apr. 27, 2020.
Prior Publication US 2023/0353901 A1, Nov. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04N 25/75 (2023.01); H04N 25/771 (2023.01)
CPC H04N 25/75 (2023.01) [H04N 25/771 (2023.01)] 20 Claims
OG exemplary drawing
 
1. An image sensor comprising:
an array of sensor pixels;
column readout circuitry, wherein a column of sensor pixels in the array is coupled to the column readout circuitry using a column line; and
image data storage circuitry coupled between the column line and a source follower transistor of a given sensor pixel in the column, wherein the image data storage circuitry comprises a set of capacitors each configured to store different phase data generated by the given sensor pixel.