US 12,316,081 B2
Method and system for preparing a terminal for an insulated wire conductor
John D. Campbell, Rochester Hills, MI (US); Elizabeth Pepper, Royal Oak, MI (US); and Edward L. Kaiser, Orion, MI (US)
Assigned to GM Global Technology Operations LLC, Detroit, MI (US)
Filed by GM GLOBAL TECHNOLOGY OPERATIONS LLC, Detroit, MI (US)
Filed on Feb. 3, 2023, as Appl. No. 18/164,078.
Prior Publication US 2024/0266812 A1, Aug. 8, 2024
Int. Cl. H02G 1/12 (2006.01); H01B 3/08 (2006.01); H01B 7/00 (2006.01)
CPC H02G 1/128 (2013.01) [H01B 3/081 (2013.01); H01B 7/0009 (2013.01); H02G 1/1285 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method for preparing an exposed terminal for a wire conductor, the method comprising:
inserting a portion of the wire conductor into a fixture, wherein the wire conductor includes an elongated conductive element encased in an insulative material, wherein the elongated conductive element has a rectangular cross-section including a first pair of opposed faces and a second pair of opposed faces, and wherein a plurality of square edges are disposed at adjacent ones of the first pair of opposed faces and a second pair of opposed faces;
executing, via a mechanical device, a mechanical ablation process to remove the insulative material from an outer surface of the plurality of square edges disposed at the adjacent ones of the first pair of opposed faces and the second pair of opposed faces along a predefined length of the portion of the wire conductor;
executing, via a laser tool, a laser ablation process to remove the insulative material from the first pair of opposed faces along the predefined length of the portion of the wire conductor; and
executing, via the laser tool, the laser ablation process to remove the insulative material from the second pair of opposed faces along the predefined length of the portion of the wire conductor,
wherein the insulative material is removed from the outer surface of the plurality of square edges, via the mechanical ablation process, and the insulative material is removed from the first pair of opposed faces and the second pair of opposed faces, via the laser ablation process, simultaneously within one process step.