US 12,315,852 B2
Micro LED based display panel
Dmitry S. Sizov, Cupertino, CA (US); Ion Bita, Santa Clara, CA (US); Jean-Jacques P. Drolet, Bavaria (DE); John T. Leonard, San Jose, CA (US); Jonathan S. Steckel, Cupertino, CA (US); Nathaniel T. Lawrence, San Francisco, CA (US); Xiaobin Xin, Sunnyvale, CA (US); and Ranojoy Bose, Fremont, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Mar. 20, 2024, as Appl. No. 18/611,108.
Application 18/611,108 is a continuation of application No. 17/809,785, filed on Jun. 29, 2022, granted, now 11,967,586.
Application 17/809,785 is a continuation of application No. 16/960,480, granted, now 11,404,400, issued on Aug. 2, 2022, previously published as PCT/US2019/014595, filed on Jan. 22, 2019.
Claims priority of provisional application 62/621,367, filed on Jan. 24, 2018.
Prior Publication US 2024/0347516 A1, Oct. 17, 2024
Int. Cl. H01L 25/075 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H01L 25/18 (2023.01); H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 33/60 (2010.01); H10H 20/856 (2025.01); H10H 20/01 (2025.01); H10H 20/81 (2025.01); H10H 20/831 (2025.01)
CPC H01L 25/0753 (2013.01) [H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/167 (2013.01); H01L 25/18 (2013.01); H10H 20/856 (2025.01); H01L 2224/08225 (2013.01); H01L 2224/32225 (2013.01); H10H 20/018 (2025.01); H10H 20/81 (2025.01); H10H 20/831 (2025.01)] 18 Claims
OG exemplary drawing
 
1. A light emitting structure comprising:
a substrate including a planar top bonding surface including a top surface dielectric bonding layer and a first group of electrode pads;
an emission layer stack-up hybrid bonded to the planar top bonding surface of the substrate, the emission layer stack-up including:
a first group of light emitting diodes (LEDs);
a dielectric bonding layer spanning underneath the first group of LEDs; and
a first group of bond posts connected to the first group of LEDs and extending through the dielectric bonding layer;
a contact terminal extending through the dielectric bonding layer;
wherein the contact terminal and each bond post is metal-metal bonded with a corresponding electrode pad of the first group of electrode pads, and the dielectric bonding layer is dielectric-dielectric bonded with the top surface dielectric bonding layer of the substrate; and
a top electrode layer spanning over the first group of LEDs and in electrical connection with the contact terminal.