| CPC H01L 24/40 (2013.01) [H01L 23/04 (2013.01); H01L 23/053 (2013.01); H01L 23/49811 (2013.01); H01L 24/37 (2013.01); H01L 23/142 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/37011 (2013.01); H01L 2224/37012 (2013.01); H01L 2224/40091 (2013.01); H01L 2224/40101 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/73221 (2013.01)] | 16 Claims |
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10. A semiconductor module, comprising:
a semiconductor chip;
a connection target; and
a wiring structure including a conductive member electrically connecting the semiconductor chip to the connection target, wherein
the conductive member has one side and another side opposite to each other in a first direction and includes a first bonding part having a main surface that is flat and has two opposing sides extending in the first direction, the first bonding part being disposed at the one side of the conductive member and being bonded to the semiconductor chip,
a second bonding part having a main surface that is flat and has two opposing sides extending in the first direction, the second bonding part being disposed at the other side of the conductive member spaced from the first bonding part in the first direction and being bonded to the connection target, the main surface of the second bonding part extending continuously between the two opposing sides thereof in a second direction orthogonal to the first direction and parallel to the main surfaces of the first and second bonding parts, and
first and second joining parts respectively having first and second wall sections, the first joining part being directly connected to respective ones of the two opposing sides of the first and second bonding parts and extending in a third direction away from the main surfaces of the first and second bonding parts, the second joining part being directly connected to respective other ones of the two opposing sides of the first and second bonding parts and extending in a fourth direction away from the main surfaces of the first and second bonding parts, the first joining part having a flat surface parallel to a plane defined by the first and third directions, the second joining part having a flat surface parallel to the plane defined by the first and fourth directions, the flat surface of the first joining part and the flat surface of the second joining part facing each other, the flat surface of the first joining part and the flat surface of the second joining part being separated by a space that continuously extends in the first direction between the first bonding part and the second bonding part so as to overlap with the first and second wall sections as seen in a side view of the wiring structure;
wherein an angle between the main surface of the first bonding part and the flat surface parallel to a plane defined by the first and third directions or an angle between the main surface of the second bonding part and the flat surface parallel to a plane defined by the first and third directions is in a range of 90 degrees to 135 degrees, and
wherein an angle between the main surface of the first bonding part the flat surface parallel to a plane defined by the first and fourth directions or an angle between the main surface of the second bonding part and the flat surface parallel to a plane defined by the first and fourth is in a range of 90 degrees to 135 degrees.
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