US 12,315,818 B2
Interconnection structure of a semiconductor chip having pads of different widths and semiconductor package including the interconnection structure
Keumhee Ma, Suwon-si (KR); and Chulyong Jang, Anyang-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Mar. 27, 2023, as Appl. No. 18/126,759.
Application 18/126,759 is a continuation of application No. 17/213,025, filed on Mar. 25, 2021, granted, now 11,626,370.
Claims priority of application No. 10-2020-0122984 (KR), filed on Sep. 23, 2020.
Prior Publication US 2023/0253336 A1, Aug. 10, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/5386 (2013.01) [H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/08146 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11622 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16155 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1437 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An interconnection structure of a semiconductor chip, the interconnection structure comprising:
an interconnection via arranged in the semiconductor chip;
a lower pad arranged on a lower end of the interconnection via exposed through a lower surface of the semiconductor chip;
a conductive bump arranged on the lower pad; and
an upper pad including a body pad arranged on and directly contacting an upper end of the interconnection via exposed through an upper surface of the semiconductor chip and an interconnection pad arranged on and directly contacting the body pad,
wherein each of the body pad and the interconnection pad has a width wider than a width of the interconnection via and narrower than a width of the lower pad, and
wherein a width of a planar upper surface of the body pad is substantially the same as a width of a planar upper surface of the interconnection pad, and
wherein a side surface of the interconnection pad is coplanar with a side surface of the body pad.