US 12,315,780 B2
Technologies for processor loading mechanisms
Ralph V. Miele, Hillsboro, OR (US); Phil Geng, Washougal, WA (US); Mengqi Liu, Hillsboro, OR (US); David Shia, Portland, OR (US); Sandeep Ahuja, Portland, OR (US); Eric W. Buddrius, Hillsboro, OR (US); and Jeffory L. Smalley, Olympia, WA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Feb. 26, 2021, as Appl. No. 17/187,470.
Prior Publication US 2021/0193558 A1, Jun. 24, 2021
Int. Cl. H01L 23/40 (2006.01); G06F 1/18 (2006.01); G06F 1/20 (2006.01); H01L 23/367 (2006.01); H05K 7/20 (2006.01)
CPC H01L 23/4006 (2013.01) [H01L 2023/4068 (2013.01); H01L 2023/4081 (2013.01); H01L 2023/4087 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A system comprising:
a mainboard including a processor socket and a bolster plate;
an integrated circuit component physically coupled to the processor socket;
a heat sink including a heat sink base in contact with a surface of the integrated circuit component, the heat sink base including a perimeter and a thickness that extends from a first surface of the heat sink base to a second surface of the heat sink base, the second surface opposite the first surface, the heat sink base including a cut out defining a portion of the perimeter of the heat sink base, the cut out extending through the thickness; and
a load plate in contact with the integrated circuit component, the load plate fastened to the bolster plate with a fastener positioned in an area defined by the cut out, the heat sink and the load plate to apply a force on the integrated circuit component to press the integrated circuit component into the processor socket.