US 12,315,749 B2
Methods of installing a purge fluid conditioning element into a semiconductor substrate carrying container
Matthew A. Fuller, Colorado Springs, CO (US); Shawn D. Eggum, Lonsdale, MN (US); and Mark V. Smith, Colorado Springs, CO (US)
Assigned to ENTEGRIS, INC., Billerica, MA (US)
Filed by ENTEGRIS, INC., Billerica, MA (US)
Filed on May 27, 2022, as Appl. No. 17/827,300.
Claims priority of provisional application 63/291,149, filed on Dec. 17, 2021.
Prior Publication US 2023/0197489 A1, Jun. 22, 2023
Int. Cl. H01L 21/673 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/67386 (2013.01) [H01L 21/67017 (2013.01); H01L 21/67389 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method comprising installing a purge fluid conditioning element having a base portion and a conditioning portion into an interior space of a semiconductor substrate carrying container that includes a plurality of walls that define the interior space and that has an opening that is sized to permit a semiconductor substrate to be inserted into and removed from the interior space, wherein installing the purge fluid conditioning element comprises installing the purge fluid conditioning element from outside the semiconductor substrate carrying container and through a port formed in one of the walls.