US 12,315,680 B2
Multilayer ceramic electronic component
Ken Tominaga, Nagaokakyo (JP); and Satoshi Muramatsu, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Jun. 24, 2022, as Appl. No. 17/848,434.
Claims priority of application No. 2021-117585 (JP), filed on Jul. 16, 2021.
Prior Publication US 2023/0018369 A1, Jan. 19, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/2325 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A multilayer ceramic electronic component comprising:
a multilayer body including a plurality of ceramic layers that are laminated, the multilayer body including a first main surface and a second main surface facing each other in a height direction that is a laminating direction, a first side surface and a second side surface facing each other in a width direction orthogonal or substantially orthogonal to the height direction, and a first end surface and a second end surface facing each other in a length direction orthogonal or substantially orthogonal to the laminating direction and the width direction;
a first internal electrode layer on a ceramic layer among the plurality of ceramic layers and exposed to the first end surface;
a second internal electrode layer on a ceramic layer among the plurality of ceramic layers and exposed to the second end surface;
a first external electrode connected to the first internal electrode layer, and located on the first end surface, on a portion of the first main surface, and on a portion of the second main surface; and
a second external electrode connected to the second internal electrode layer, and located on the second end surface, on a portion of the first main surface, and on a portion of the second main surface; wherein
the first external electrode and the second external electrode include a base electrode layer and a plating layer;
the base electrode layer is a thin film electrode on at least a portion of the first main surface and a portion of the second main surface, the thin film electrode including at least one of Ni, Cr, Cu, or Ti;
the plating layer includes a lower layer plating layer exclusively on the first end surface and the second end surface, a middle layer plating layer on the lower layer plating layer, on the first end surface and the second end surface on which the lower layer plating layer is not located, and on the base electrode layer, and an upper layer plating layer on the middle layer plating layer;
when a sum of a thickness in the length direction of the lower layer plating layer and a thickness in the length direction of the middle layer plating layer on the first end surface is defined as X1, a sum of a thickness in the length direction of the lower layer plating layer and a thickness in the length direction of the middle layer plating layer on the second end surface is defined as X2, a sum of a thickness in the height direction of the base electrode layer and a thickness in the height direction of the middle layer plating layer on the first main surface is defined as Y1, and a sum of a thickness in the height direction of the base electrode layer and a thickness in the height direction of the middle layer plating layer on the second main surface is defined as Y2, a relationship of X1>Y1, X1>Y2, X2>Y1, X2>Y2 is satisfied; and
a particle diameter of a metal included in the lower layer plating layer is larger than a particle diameter of a metal included in the middle layer plating layer.