US 12,314,653 B2
Semiconductor process modeling system and method
Shigenobu Maeda, Seongnam-si (KR); Wook Kim, Yongin-si (KR); Hongsik Kim, Seoul (KR); Heejun Kim, Yongin-si (KR); Seyoung Park, Seoul (KR); Seongjin Yoo, Suwon-si (KR); Minhong Yun, Hwaseong-si (KR); and Daehan Han, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Mar. 22, 2022, as Appl. No. 17/700,825.
Claims priority of application No. 10-2021-0089329 (KR), filed on Jul. 7, 2021.
Prior Publication US 2023/0010252 A1, Jan. 12, 2023
Int. Cl. G06F 30/398 (2020.01); G06F 30/27 (2020.01); G06F 119/18 (2020.01)
CPC G06F 30/398 (2020.01) [G06F 30/27 (2020.01); G06F 2119/18 (2020.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor process modeling system comprising:
a preprocessing component configured to generate tensor data from raw data obtained from semiconductor manufacturing equipment,
wherein, when the raw data is expressed as a raw matrix representing values of a plurality of process parameters for each of a plurality of wafers, at least one element of the raw matrix is omitted,
wherein, when the tensor data is expressed as a tensor matrix representing values of a plurality of preprocessed process parameters for each of the plurality of wafers, a number of omitted elements of the tensor matrix is less than a number of omitted elements of the raw matrix, and
wherein the preprocessing component is configured to generate the tensor data by modifying the raw data based on characteristics of the plurality of process parameters for each of the plurality of wafers.