US 12,314,523 B2
Method for fabricating touch subsrate, touch subsrate, substrate and touch device
Xue Zhao, Beijing (CN); Xiaodong Xie, Beijing (CN); Min He, Beijing (CN); Tengfei Zhong, Beijing (CN); Xinxiu Zhang, Beijing (CN); Tianyu Zhang, Beijing (CN); and Huayu Sang, Beijing (CN)
Assigned to Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Filed by Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Filed on Mar. 11, 2024, as Appl. No. 18/601,284.
Application 18/601,284 is a continuation of application No. 17/615,133, granted, now 11,960,690, previously published as PCT/CN2020/139497, filed on Dec. 25, 2020.
Prior Publication US 2024/0220058 A1, Jul. 4, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 3/044 (2006.01); G03D 15/04 (2006.01)
CPC G06F 3/0446 (2019.05) [G03D 15/04 (2013.01); G06F 3/0445 (2019.05); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A substrate for forming a touch substrate, comprising:
a first electrode layer comprising a metal strip at an edge region of the first electrode layer and a first metal mesh pattern connected with the metal strip,
a second electrode layer at one side of the first electrode layer, the second electrode layer comprising a metal strip at an edge region of the second electrode layer and a second metal mesh pattern connected with the metal strip of the second electrode layer, and the metal strip of the first electrode layer being in direct contact with the metal strip of the second electrode layer to form a metal stack, and
an insulating layer between the first metal mesh pattern and the second metal mesh pattern,
wherein the metal stack is electrically connected to both the first metal mesh pattern of the first electrode layer and the second metal mesh pattern of the second electrode layer.