US 12,314,211 B2
Communication device and communication system
Junya Yamada, Kanagawa (JP); Toshihisa Hyakudai, San Diego, CA (US); and Satoshi Ota, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Filed by Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Filed on May 19, 2023, as Appl. No. 18/320,662.
Claims priority of provisional application 63/345,285, filed on May 24, 2022.
Prior Publication US 2023/0385225 A1, Nov. 30, 2023
Int. Cl. G06F 13/42 (2006.01); H04L 69/22 (2022.01)
CPC G06F 13/4282 (2013.01) [H04L 69/22 (2013.01); G06F 2213/0016 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A communication device configured to cause a first I2C communication instrument and a second I2C communication instrument connected to a communication partner device to establish communication therebetween, the communication device comprising:
an encoder that generates Header Packet Data including a target ID of the communication partner device and I2C Packet Data including a slave address and an offset address of the second I2C communication instrument;
a communication unit that transmits a transmission packet including the Header Packet Data and the I2C Packet Data generated by the encoder to the communication partner device by a Time Division Duplex (TDD) communication scheme and receives a reception packet from the communication partner device by the TDD communication scheme; and
a decoder that generates the I2C Packet Data from the reception packet, wherein
the target ID is one of a plurality of target IDs,
the communication partner device is one of a plurality of communication partner devices,
the Header Packet Data includes the plurality of target IDs respectively corresponding to the plurality of communication partner devices.