US 12,314,095 B2
Fluid couplings with magnetic latch assembly
John Paul Franz, Tomball, TX (US); and Harvey John Lunsman, Chippewa Falls, WI (US)
Assigned to Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed by HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Spring, TX (US)
Filed on Jan. 31, 2023, as Appl. No. 18/161,937.
Prior Publication US 2024/0256011 A1, Aug. 1, 2024
Int. Cl. H05K 7/20 (2006.01); F16L 37/00 (2006.01); F16L 37/096 (2006.01); G06F 1/20 (2006.01)
CPC G06F 1/20 (2013.01) [F16L 37/004 (2013.01); F16L 37/096 (2013.01); H05K 7/20272 (2013.01); H05K 7/20709 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A fluid coupling for liquid cooling of electronic devices, comprising:
a main coupling body comprising a coupling interface configured to couple with a complementary coupling interface of a second fluid coupling; and
a magnetic latch assembly coupled to the main coupling body and comprising:
a shell;
a plurality of magnets housed in the shell;
a plurality of ramp-and-hook latches coupled to the shell and arranged to engage with complementary ramp-and-hook latches of a second magnetic latch assembly coupled to the second fluid coupling.