US 12,313,892 B2
Techniques for thermal management within optical subassembly modules
Kai-Sheng Lin, Sugar Land, TX (US); Yi Wang, Katy, TX (US); and John Cheng, Houston, TX (US)
Assigned to Applied Optoelectronics, Inc., Sugar Land, TX (US)
Filed by Applied Optoelectronics, Inc., Sugar Land, TX (US)
Filed on Aug. 6, 2020, as Appl. No. 16/987,096.
Prior Publication US 2022/0045478 A1, Feb. 10, 2022
Int. Cl. G02B 6/42 (2006.01); H01S 5/023 (2021.01); H01S 5/024 (2006.01); H01S 5/02345 (2021.01); H01S 5/0239 (2021.01)
CPC G02B 6/4271 (2013.01) [G02B 6/4273 (2013.01); H01S 5/023 (2021.01); H01S 5/02415 (2013.01); G02B 6/425 (2013.01); G02B 6/4292 (2013.01); H01S 5/02345 (2021.01); H01S 5/0239 (2021.01); H01S 5/02453 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An optical subassembly module comprising:
a housing defining a non-hermetically sealed cavity;
a substrate at least partially disposed in the non-hermetically sealed cavity and comprising at least a first component mounting surface and a second component mounting surface opposite the first component mounting surface;
a thermoelectric cooler coupled to and supported by the first component mounting surface of the substrate, wherein an entirety of the thermoelectric cooler is disposed in the non-hermetically sealed cavity;
a plurality of laser assemblies coupled to the second component mounting surface of the substrate, wherein an entirety of the laser assemblies is disposed in the non-hermetically sealed cavity;
wherein the thermoelectric cooler is thermally and directly coupled to the plurality of laser assemblies through a plurality of openings in the substrate and thermally isolated from the substrate, wherein a layer of thermally insulating material is disposed between the first component mounting surface of the substrate and the thermoelectric cooler to thermally isolate the substrate from the thermoelectric cooler; and
wherein the thermoelectric cooler thermally couples the plurality of laser assemblies to the housing via a thermal communication path that extends in the non-hermetically sealed cavity from the plurality of laser assemblies, through the thermoelectric cooler and to the housing.