US 12,313,891 B2
Thermal management system for multi-chip-module and associated methods
Roy Edward Meade, Lafayette, CA (US); and Vladimir Stojanovic, Berkeley, CA (US)
Assigned to Ayar Labs, Inc., San Jose, CA (US)
Filed by Ayar Labs, Inc., Santa Clara, CA (US)
Filed on Nov. 7, 2022, as Appl. No. 17/982,476.
Application 17/982,476 is a continuation of application No. 17/021,805, filed on Sep. 15, 2020, granted, now 11,493,708.
Application 17/021,805 is a continuation of application No. 16/287,984, filed on Feb. 27, 2019, granted, now 10,775,576, issued on Sep. 15, 2020.
Claims priority of provisional application 62/637,357, filed on Mar. 1, 2018.
Prior Publication US 2023/0068239 A1, Mar. 2, 2023
Int. Cl. H01L 23/36 (2006.01); G02B 6/42 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2023.01)
CPC G02B 6/4269 (2013.01) [G02B 6/4271 (2013.01); H01L 23/36 (2013.01); H01L 25/165 (2013.01); H01L 25/50 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A thermal management system for an electronic package, comprising:
a first thermal-transfer-environment thermally connected to a heat source within the electronic package;
a second thermal-transfer-environment thermally connected to a temperature-sensitive component within the electronic package, wherein the second thermal-transfer-environment is substantially thermally separated from the first thermal-transfer-environment;
a first heat transfer member within the first thermal-transfer-environment and a second heat transfer member within the second thermal-transfer-environment, the first heat transfer member thermally separated from the second heat transfer member by a thermal break, wherein the first heat transfer member is positioned to wrap around at least two proximately positioned sides of the second heat transfer member, and wherein the thermal break is maintained between the at least two proximately positioned sides of the first and second heat transfer members; and
a thermally conductive plate in contact with both the first heat transfer member and the second heat transfer member, the thermally conductive plate including at least one perforation aligned with the thermal break.