US 12,313,710 B2
B1+ mapping near metallic hardware
Mahesh Bharath Keerthivasan, Tucson, AZ (US); and Iman Khodarahmi, New York, NY (US)
Assigned to SIEMENS HEALTHINEERS AG, Forchheim (DE); and NEW YORK UNIVERSITY, New York, NY (US)
Filed by SIEMENS HEALTHINEERS AG, Forchheim (DE); and NEW YORK UNIVERSITY, New York, NY (US)
Filed on Feb. 28, 2023, as Appl. No. 18/115,610.
Claims priority of provisional application 63/268,713, filed on Mar. 1, 2022.
Prior Publication US 2023/0280422 A1, Sep. 7, 2023
Int. Cl. G01R 33/24 (2006.01); G01R 33/561 (2006.01); G01R 33/565 (2006.01); G01R 33/58 (2006.01)
CPC G01R 33/246 (2013.01) [G01R 33/5612 (2013.01); G01R 33/56554 (2013.01); G01R 33/5659 (2013.01); G01R 33/586 (2013.01); G01R 33/5617 (2013.01); G01R 33/56536 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method, comprising:
obtaining a scaling factor corresponding to a ratio of actual B1+ to nominal B1+ for a location proximate a metallic object by minimizing a function of an acquired dataset and a simulated dataset; and
obtaining a B1+ map for a region proximate the metallic object based on the scaling factor;
wherein the simulated dataset comprises:
a first signal from a first pulse having a first excitation flip angle and a first refocusing flip angle; and
a second signal from a second pulse having a second excitation flip angle and a second refocusing flip angle.