US 12,313,677 B2
Pressurizing device for semiconductor testing and semiconductor test device including the same
Changgeun Yang, Hwaseong-si (KR); Youbi Kim, Uijeongbu-si (KR); Sanghun Lee, Hwaseong-si (KR); and Sangsik Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Dec. 8, 2022, as Appl. No. 18/077,496.
Claims priority of application No. 10-2020-0002524 (KR), filed on Jan. 7, 2022.
Prior Publication US 2023/0221366 A1, Jul. 13, 2023
Int. Cl. G01R 31/28 (2006.01); G01R 1/04 (2006.01)
CPC G01R 31/2893 (2013.01) [G01R 1/0433 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A pressurizing device for semiconductor testing comprising:
a tension block;
a first pusher block extending through the tension block;
a base plate on the first pusher block;
a second pusher block on the tension block and extending through the base plate;
a first spring connected to each of the first pusher block and the second pusher block;
a second spring connected to each of the tension block and the base plate;
a press plate on the base plate; and
a press shaft coupled to the press plate,
wherein the press shaft comprises a shaft hole that passes through a first end of the press shaft to a second end of the press shaft.