US 12,313,656 B2
Snap-on current sensor design
Engelbert Hetzmannseder, Klosterneuburg (AT); Jianfei Zhao, Suzhou (CN); and Linas Sarkauskas, Vilnius (LT)
Assigned to Suzhou Littelfuse OVS Co., Ltd., Suzhou (CN)
Filed by Suzhou Littelfuse OVS Co., Ltd., Suzhou (CN)
Filed on Jul. 29, 2022, as Appl. No. 17/816,027.
Claims priority of application No. 202110900035.0 (CN), filed on Aug. 6, 2021.
Prior Publication US 2023/0042505 A1, Feb. 9, 2023
Int. Cl. G01R 15/20 (2006.01); G01R 19/00 (2006.01)
CPC G01R 15/20 (2013.01) [G01R 19/0092 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A snap-on assembly comprising:
a housing holding a first integrated circuit (IC), the first IC comprising a first sensor;
a connector to supply power to the first IC and to transmit a signal from the first IC to an electronic circuit;
a first insert to fit into an opening of the housing, the first insert including a first cylindrical receptacle for receiving a conductor on a first side thereof; and
a second insert to fit into the opening of the housing, the second insert including a second cylindrical receptacle for receiving the conductor on a second side thereof opposite the first side,
wherein the second insert is adapted to be placed in the opening of the housing, followed by the conductor, followed by the first insert,
wherein the first insert and the second insert secure the conductor in the housing without a mechanical fastener, and
wherein the first sensor measures a magnetic field resulting from a current traveling through the conductor.