US 12,313,478 B2
Low drift force sensor with capacitive capability
Franklin N. Eventoff, Bow, WA (US); James Aaron Holmes, Anacortes, WA (US); and Christopher Ray Wittmier, Everett, WA (US)
Assigned to Sensitronics, LLC, Bow, WA (US)
Filed by Sensitronics, LLC, Bow, WA (US)
Filed on Sep. 29, 2022, as Appl. No. 17/956,616.
Claims priority of provisional application 63/251,569, filed on Oct. 1, 2021.
Prior Publication US 2023/0105781 A1, Apr. 6, 2023
Int. Cl. G01L 1/14 (2006.01); G01L 1/26 (2006.01)
CPC G01L 1/142 (2013.01) 18 Claims
OG exemplary drawing
 
1. A force sensing assembly comprising:
a generally planar first substrate having a conductor surface and an opposing touch surface;
a plurality of parallel conductive traces on the conductor surface of the first substrate;
a first array of conductive patches oriented between adjacent parallel conductive traces and each patch is electrically connected to the conductive traces on a conductive surface of the first substrate, each conductive patch of the first array of conductive patches is formed as a layer, wherein the layer is comprised of conductive material and a plurality of conductive balls between 10 and 80 μm in size;
a generally planar second substrate having a conductor surface and an opposing touch surface;
a plurality of parallel conductive traces on a conductive surface of the second substrate;
a second array of conductive patches oriented between adjacent parallel conductive traces and each patch is electrically connected to the conductive traces on the conductive surface of the second substrate, each conductive patch of the second array of conductive patches is formed of conductive material including a plurality of conductive balls;
wherein the first substrate and the second substrate are oriented parallel to each other with the conductive surfaces of each substrate in apposition and the plurality of parallel conductive traces on the first substrate oriented perpendicular to the plurality of conductive traces on the second substrate; and
a plurality of insulating pads secured on the conductive traces on the first substrate where the perpendicular traces of the second substrate intersect the traces of the first substrate.