US 12,313,347 B2
Locally embedded phase change material for heat sinks
Robert Ruffino, Richardson, TX (US); Matthew Spitzner, Lowry Crossing, TX (US); and Gregory Gorski, Highlands Ranch, CO (US)
Assigned to L3Harris Technologies, Inc., Melbourne, FL (US)
Filed by L3Harris Technologies, Inc., Melbourne, FL (US)
Filed on Feb. 8, 2023, as Appl. No. 18/107,096.
Prior Publication US 2024/0263890 A1, Aug. 8, 2024
Int. Cl. F28D 17/00 (2006.01); F28D 20/02 (2006.01)
CPC F28D 20/02 (2013.01) 12 Claims
OG exemplary drawing
 
1. A PCM heat sink for use in thermally managing components of a system having a maximum permissible operating temperature significantly higher than ambient temperature, said heat sink comprising;
a thermally conductive body member having mutually perpendicular axial and transverse dimensions and a plurality of PCM-receiving bores defined therein from at least one surface thereof;
a plurality of PCM rods disposed in respective ones of said bores, wherein said rods are in solid phase at ambient temperature and have a phase change temperature from solid to liquid at or just below said maximum permissible operating temperature; and
a plurality of sealing members disposed in respective ones of said bores to seal said rods in said bores at said one surface;
wherein body member has multiple through-holes defined axially therethrough, and wherein said bores are interspersed between and extend parallel to said through-holes.