US 12,312,677 B2
Step coverage using an inhibitor molecule for high aspect ratio structures
Wontae Noh, Seoul (KR); and Jooho Lee, Seoul (KR)
Assigned to L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude, Paris (FR)
Filed by L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude, Paris (FR)
Filed on Oct. 16, 2020, as Appl. No. 17/072,882.
Prior Publication US 2022/0119939 A1, Apr. 21, 2022
Int. Cl. C23C 16/04 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01); H01L 21/02 (2006.01)
CPC C23C 16/045 (2013.01) [C23C 16/4408 (2013.01); C23C 16/45534 (2013.01); C23C 16/45536 (2013.01); H01L 21/02271 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for improving step coverage of a film deposited on high aspect ratio (HAR) apertures in a substrate, the method comprising:
i) sequentially or simultaneously exposing the substrate to a vapor of an inhibitor, a vapor of a precursor ZrCp(NMe2)3 and a vapor of a co-reactant; and
ii) allowing the film with a desired step coverage being deposited on the surface of the HAR apertures through a vapor deposition process,
wherein the inhibitor is selected from one or more of
a) phosphorus based aliphatic and aromatic inhibitors;
b) boron based aliphatic and aromatic inhibitors;
c) H2O vapor, H2 gas, CO gas, CS gas and nitrogen oxide (NOx) gases; and
d) combinations of a)-c).