| CPC C11D 7/3209 (2013.01) [C11D 7/3281 (2013.01); C11D 17/08 (2013.01); C11D 2111/22 (2024.01); H01L 21/304 (2013.01)] | 13 Claims |
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1. A kit for preparing a cleaning agent with a pH of 7.5 to 13.0 that is used in cleaning of a semiconductor substrate having undergone a chemical mechanical polishing process, the kit comprising:
a first liquid containing a compound represented by Formula (1), an acidic compound and water and showing acidic properties; and
a second liquid containing a basic compound and showing alkaline properties,
wherein the basic compound comprises a hydroxylamine compound, and
the basic compound further comprises at least one selected from the group consisting of a diamine compound, an amidine compound, an azole compound, a pyrazine compound, a pyrimidine compound, and a quaternary ammonium compound,
![]() where R1 to R5 each independently represent a hydrogen atom, a hydroxyl group, a carboxyl group, or an alkoxycarbonyl group, and at least two of R1 to R5 represent a hydroxyl group, provided that a combination in which R1 and R5 each represent a hydroxyl group, a combination in which R2 and R4 each represent a hydroxyl group, and a combination in which R3 and R5 each represent a hydroxyl group are excluded.
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