	US 12,312,510 B2
	Adhesive film and flexible printed circuit board
Hisae Oba, Tokyo (JP); Hiroyuki Komori, Kanagawa (JP); and Nozomu Suzuki, Kanagawa (JP)
Assigned to MEKTEC CORPORATION, Tokyo (JP)
Filed by MEKTEC CORPORATION, Tokyo (JP)
Filed on Dec. 2, 2020, as Appl. No. 17/109,440.
Claims priority of application No. 2019-218329 (JP), filed on Dec. 2, 2019; and application No. 2020-175552 (JP), filed on Oct. 19, 2020.
Prior Publication US 2021/0163790 A1, Jun. 3, 2021
Int. Cl. C09J 7/25 (2018.01); C08G 73/10 (2006.01); C09J 127/16 (2006.01); C09J 127/20 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01)

CPC C09J 7/25 (2018.01) [C08G 73/1007 (2013.01); C08G 73/1067 (2013.01); C09J 127/16 (2013.01); C09J 127/20 (2013.01); H05K 1/0393 (2013.01); H05K 3/4688 (2013.01); C09J 2479/08 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/015 (2013.01); H05K 2201/05 (2013.01)]

7 Claims

1. An adhesive film comprising:

a resin film layer; and

an adhesive layer laminated to the resin film layer, wherein

the adhesive layer includes an adhesive agent,

the adhesive agent contains a fluorine-based rubber,

the adhesive layer is in a B stage state,

the resin film layer includes a liquid crystal polymer,

an oxygen transmission rate at 200° C. of the resin film layer, measured in accordance with JIS K7126-1, is 1.50×10⁻¹⁰cc·cm/cm²·sec·cmHg or less, and

a 3% thermal weight reduction temperature of the adhesive agent is 320° C. or higher.