US 12,312,237 B2
MEMS switch and manufacture method
Yingli Shi, Beijing (CN)
Assigned to Beijing BOE Technology Development Co., Ltd., Beijing (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 17/777,427
Filed by Beijing BOE Technology Development Co., Ltd., Beijing (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Jun. 3, 2021, PCT No. PCT/CN2021/098111
§ 371(c)(1), (2) Date May 17, 2022,
PCT Pub. No. WO2022/252177, PCT Pub. Date Dec. 8, 2022.
Prior Publication US 2024/0166496 A1, May 23, 2024
Int. Cl. H01H 59/00 (2006.01); B81B 7/00 (2006.01)
CPC B81B 7/0054 (2013.01) [B81B 2201/018 (2013.01); B81B 2203/0109 (2013.01); H01H 59/0009 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A flexible Micro-Electro-Mechanical System (MEMS) switch, comprising an MEMS body and a packaging body outside the MEMS body, wherein the packaging body comprises a first flexible cover plate and a second flexible cover plate, the first flexible cover plate and the second flexible cover plate are arranged at opposite sides of the MEMS body respectively, a first cavity is formed between the first flexible cover plate and the MEMS body, and a second cavity is formed between the second flexible cover plate and the MEMS body;
wherein the MEMS body comprises a flexible base substrate and a functional element on the flexible base substrate, the flexible base substrate comprises a first portion where the functional element is arranged and a second portion surrounding the first portion, the second portion is of an annular shape and coupled to the packaging body, the first portion comprises a plurality of side walls facing the second portion, the plurality of side walls comprises at least a first side wall, and a part of the first side wall in an extension direction of the first side wall is depressed in a direction away from the second portion to form a gap between the first side wall and the second portion.