US 12,311,748 B1
Modular electronic component enclosure
Sriniket Sreenivas Achar, Sterling Heights, MI (US); Akash Thombre, Tustin, CA (US); Piyush Khater, Mission Viejo, CA (US); Bruce Philip Edwards, Menlo Park, CA (US); Suraj Shroff, Sunnyvale, CA (US); Tom Jolly, Leicester (GB); and Brandon Louis Fennema, Rancho Santa Margarita, CA (US)
Assigned to Rivian IP Holdings, LLC, Irvine, CA (US)
Filed by Rivian IP Holdings, LLC, Irvine, CA (US)
Filed on Feb. 21, 2024, as Appl. No. 18/583,769.
Int. Cl. B60K 1/04 (2019.01); H01M 50/209 (2021.01); H01M 50/24 (2021.01); H01M 50/249 (2021.01)
CPC B60K 1/04 (2013.01) [H01M 50/209 (2021.01); H01M 50/24 (2021.01); H01M 50/249 (2021.01); B60K 2001/0438 (2013.01); H01M 2220/20 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
an enclosure for one or more electrical components for a battery pack, wherein the enclosure is configured to mechanically and electrically couple to an energy volume of the battery pack, and wherein the enclosure comprises:
an access panel comprising:
an insulating structure configured to at least partially cover the one or more electrical components; and
a conductive layer on a surface of the insulating structure;
a tray configured for mounting the one or more electrical components thereto, wherein the tray and the access panel are configured to at least partially enclose the one or more electrical components, and wherein the tray comprises a solid insulating tray; and
at least one grounding structure coupled to the solid insulating tray.