US 12,311,437 B2
Thixomolding material
Yasutoshi Hideshima, Matsumoto (JP); Setsuya Iwashita, Nirasaki (JP); Fumiya Maeda, Azumino (JP); Shunsuke Uchizono, Shiojiri (JP); Koichi Ozaki, Okayama (JP); and Tadao Fukuta, Kurashiki (JP)
Assigned to SEIKO EPSON CORPORATION, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Mar. 25, 2022, as Appl. No. 17/656,544.
Claims priority of application No. 2021-057130 (JP), filed on Mar. 30, 2021.
Prior Publication US 2022/0314314 A1, Oct. 6, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B22F 1/16 (2022.01); B22D 17/00 (2006.01); B22D 23/06 (2006.01); B22F 1/05 (2022.01); B22F 1/068 (2022.01); B22F 1/10 (2022.01); B22F 1/102 (2022.01); B22F 1/12 (2022.01); B22F 1/14 (2022.01); B22F 3/22 (2006.01); B22F 8/00 (2006.01); B32B 1/00 (2006.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B32B 15/16 (2006.01); C22C 1/10 (2023.01); C22C 32/00 (2006.01); B22F 3/00 (2021.01); C22C 1/05 (2023.01)
CPC B22F 1/16 (2022.01) [B22D 17/007 (2013.01); B22D 23/06 (2013.01); B22F 1/05 (2022.01); B22F 1/068 (2022.01); B22F 1/10 (2022.01); B22F 1/102 (2022.01); B22F 1/12 (2022.01); B22F 1/14 (2022.01); B22F 3/225 (2013.01); B22F 8/00 (2013.01); B32B 1/00 (2013.01); B32B 15/04 (2013.01); B32B 15/08 (2013.01); B32B 15/16 (2013.01); C22C 1/1084 (2013.01); C22C 32/0084 (2013.01); B22F 3/003 (2013.01); B22F 2301/058 (2013.01); B22F 2302/40 (2013.01); B22F 2998/10 (2013.01); C22C 1/05 (2013.01); Y10T 428/12181 (2015.01); Y10T 428/12229 (2015.01); Y10T 428/12556 (2015.01); Y10T 428/12569 (2015.01); Y10T 428/12576 (2015.01); Y10T 428/12625 (2015.01); Y10T 428/12729 (2015.01); Y10T 428/29 (2015.01); Y10T 428/2918 (2015.01); Y10T 428/2927 (2015.01); Y10T 428/2933 (2015.01); Y10T 428/2938 (2015.01); Y10T 428/2947 (2015.01); Y10T 428/2982 (2015.01); Y10T 428/2991 (2015.01); Y10T 428/2998 (2015.01)] 3 Claims
OG exemplary drawing
 
1. A thixomolding material comprising:
a metal body that contains Mg as a main component, wherein Mg has highest content by mass in the metal body than other additive components in the metal body; and
a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C, wherein
an average particle diameter of the C particles is 1 μm or more and 100 μm or less, and
a mass fraction of the C particles in a total mass of the metal body and the C particles is 5.0 mass % or more and 40.0 mass % or less.