US 12,311,415 B2
Substrate processing apparatus and substrate processing method
Do Hyung Kim, Chungcheongnam-do (KR); Dae Hun Kim, Pyeongtaek-si (KR); Young Jin Kim, Cheonan-si (KR); Tae Ho Kang, Suwon-si (KR); Young Joon Han, Cheonan-si (KR); Eun Hyeok Choi, Cheonan-si (KR); and Jun Gwon Lee, Ulsan (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Mar. 27, 2023, as Appl. No. 18/126,949.
Claims priority of application No. 10-2022-0108475 (KR), filed on Aug. 29, 2022.
Prior Publication US 2024/0066564 A1, Feb. 29, 2024
Int. Cl. B08B 5/02 (2006.01); B08B 3/02 (2006.01); B08B 13/00 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); F26B 21/00 (2006.01)
CPC B08B 5/02 (2013.01) [B08B 3/022 (2013.01); B08B 13/00 (2013.01); H01L 21/02057 (2013.01); H01L 21/0209 (2013.01); H01L 21/67051 (2013.01); F26B 21/004 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a substrate support unit comprising a support member configured to support a substrate;
a processing fluid supply unit configured to supply a processing fluid toward the substrate; and
a purge gas supply member configured to supply a purge gas toward the substrate,
wherein the purge gas supply member comprises:
a first supply pipe discharging the purge gas in a first direction toward a lower surface of the substrate; and
a second supply pipe discharging the purge gas in a second direction opposite to the first direction,
wherein the purge gas supply member is provided inside a body, the body having an inner space divided into an upper space and a lower space and being inserted into the substrate support unit,
wherein the upper space of the body is in communication with the first supply pipe,
wherein the lower space of the body is in communication with the second supply pipe, and
wherein the upper space and the lower space are not in communication with each other within the body.