US 11,991,918 B2
Flexible display device
Saemleenuri Lee, Seoul (KR); SeYeoul Kwon, Goyang-si (KR); and Dojin Kim, Goyang-si (KR)
Assigned to LG Display Co., Ltd., Seoul (KR)
Filed by LG Display Co., Ltd., Seoul (KR)
Filed on May 11, 2022, as Appl. No. 17/741,923.
Application 17/741,923 is a continuation of application No. 16/943,505, filed on Jul. 30, 2020, granted, now 11,362,292.
Application 16/943,505 is a continuation of application No. 16/254,275, filed on Jan. 22, 2019, granted, now 10,847,545, issued on Nov. 24, 2020.
Application 16/254,275 is a continuation of application No. 15/147,498, filed on May 5, 2016, granted, now 10,224,344, issued on Mar. 5, 2019.
Claims priority of application No. 10-2015-0178916 (KR), filed on Dec. 15, 2015.
Prior Publication US 2022/0271243 A1, Aug. 25, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H10K 77/10 (2023.01); H01L 27/12 (2006.01); H01L 29/786 (2006.01); H10K 50/80 (2023.01); H10K 59/131 (2023.01); H10K 59/121 (2023.01); H10K 59/126 (2023.01); H10K 102/00 (2023.01)
CPC H10K 77/111 (2023.02) [H01L 27/1218 (2013.01); H01L 27/124 (2013.01); H01L 29/78603 (2013.01); H01L 29/78633 (2013.01); H10K 50/80 (2023.02); H10K 59/131 (2023.02); H10K 59/1213 (2023.02); H10K 59/126 (2023.02); H10K 2102/311 (2023.02); Y02E 10/549 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A display device comprising:
a flexible substrate including an active area and a non-display area, the non-display area including a bending area configured to be bent;
a link line including a first link line and a second link line in the non-display area;
a bending connection line including a first end connected to the first link line and a second end connected to the second link line, the bending connection line electrically connected with the first link line and the second link line on the flexible substrate;
a first buffer layer and a second buffer layer in the bending area of the flexible substrate; and
an inorganic layer that surrounds the bending connection line, the inorganic layer between the first buffer layer and the second buffer layer in the bending area of the flexible substrate,
wherein the first link line is connected to the first end of the bending connection line via a first contact hole, and the second link line is connected to the second end of the bending connection line via a second contact hole,
wherein the first buffer layer is directly under the inorganic layer and the second buffer layer is directly on the inorganic layer.