US 11,991,870 B1
Thermal interface material for electronic device
Michael Nikkhoo, Saratoga, CA (US); and Brian Toleno, Cupertino, CA (US)
Assigned to Meta Platforms Technologies, LLC, Menlo Park, CA (US)
Filed by Meta Platforms Technologies, LLC, Menlo Park, CA (US)
Filed on Jul. 21, 2022, as Appl. No. 17/814,184.
Claims priority of provisional application 63/306,906, filed on Feb. 4, 2022.
Int. Cl. H05K 7/20 (2006.01); G06F 1/16 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20945 (2013.01) [G06F 1/163 (2013.01); G06F 1/206 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
an electronic component;
a thermal ground;
a first portion of thermal interface material comprising:
a first body comprising thermally conductive silicone, the first body disposed in thermal contact with the electronic component, and
a first plurality of thermally conductive fibers disposed within the first body of the first portion of thermal interface material;
a second portion of thermal interface material comprising:
a second body disposed in thermal contact with the thermal ground, and
a second plurality of thermally conductive fibers disposed within the second body; and
a thermal conduit coupled to the first portion of thermal interface material and the second portion of thermal interface material and spanning a distance therebetween.