US 11,991,869 B2
Thermal management system including an overmolded layer and a conductive layer over a circuit board
Steven Nicholas Grolle, Mountain View, CA (US); Gargi Kailkhura, San Jose, CA (US); Peter H. J. How, Honolulu, HI (US); Charles Ingalz, San Jose, CA (US); Andrew Diao, Santa Cruz, CA (US); and Stephen Robert Bannick, San Francisco, CA (US)
Assigned to Lunar Energy, Inc., Mountain View, CA (US)
Filed by Lunar Energy, Inc., Mountain View, CA (US)
Filed on Oct. 10, 2023, as Appl. No. 18/484,287.
Claims priority of provisional application 63/415,139, filed on Oct. 11, 2022.
Prior Publication US 2024/0121923 A1, Apr. 11, 2024
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/209 (2013.01) [H05K 1/0203 (2013.01); H05K 7/20454 (2013.01); H05K 7/20509 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A system, comprising:
an overmolded layer that is placed above a top surface and below a bottom surface of a circuit board, wherein the overmolded layer exposes at least communication interfaces on the circuit board and surrounds a heat generating component on the circuit board, wherein the overmolded layer further exposes a first set of mounting points on the circuit board, and wherein the system is operable to be mounted to an interior of an inverter device via the first set of mounting points;
a conductive layer that is placed over the overmolded layer on the top surface of the circuit board, wherein the conductive layer exposes the communication interfaces of the circuit board and covers the heat generating component on the circuit board, wherein the conductive layer comprises through-holes corresponding to the first set of mounting points on the circuit board, wherein the conductive layer is operable to be fastened to the circuit board via the first set of mounting points; and
wherein heat from the heat generating component is transferred into the conductive layer.