US 11,991,863 B2
Apparatus, system, and method for mitigating deformation of spring-loaded heatsinks
Nikola Ikonomov, Sunnyvale, CA (US); Attila I. Aranyosi, Sunnyvale, CA (US); and Sean Kim, Sunnyvale, CA (US)
Assigned to Juniper Networks, Inc., Sunnyvale, CA (US)
Filed by Juniper Networks, Inc., Sunnyvale, CA (US)
Filed on Nov. 22, 2021, as Appl. No. 17/532,633.
Prior Publication US 2023/0164956 A1, May 25, 2023
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/2049 (2013.01) [G06F 1/20 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a heat-emitting component coupled to a circuit board;
a heatsink that includes:
a base;
at least one reinforcement standoff coupled to the base; and
a designated area physically coupled to the heat-emitting component;
a plurality of springs that apply forces that support the physical coupling between the designated area of the heatsink and the heat-emitting component;
a pressure plate that is coupled between the heatsink and the plurality of springs and makes direct contact with the at least one reinforcement standoff and concentrates the forces applied by the plurality of springs toward the designated area of the heatsink via the at least one reinforcement standoff; and
a backing plate that is applied opposite the pressure plate relative to the circuit board and is secured to the pressure plate via a plurality of mounting posts.