US 11,991,860 B2
Fluid cooling device
Chien-Yu Chen, New Taipei (TW); and Wei-Hao Chen, New Taipei (TW)
Assigned to AURAS TECHNOLOGY CO., LTD., New Taipei (TW)
Filed by Auras Technology Co., Ltd., New Taipei (TW)
Filed on Oct. 28, 2021, as Appl. No. 17/513,297.
Claims priority of provisional application 63/107,075, filed on Oct. 29, 2020.
Prior Publication US 2022/0142002 A1, May 5, 2022
Int. Cl. G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/20345 (2013.01) [H05K 7/20327 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A fluid cooling device, comprising:
a bottom plate, wherein the bottom plate comprises a substrate and a chip;
an adhesive layer; and
a spray cooling cover, wherein the adhesive layer fixes the spray cooling cover on the bottom plate, wherein the spray cooling cover comprises a fluid inlet and a plurality of fluid outlets to utilize a working fluid to directly cool the chip, wherein the spray cooling cover further comprises:
a cooling cavity, wherein the chip is located in the cooling cavity;
a fluid jet array disposed above the cooling cavity to spray the working fluid to a surface of the chip;
a plurality of buffer cavities respectively located beside the cooling cavity; and
a plurality of discharge channels to respectively connect to the buffer cavities and corresponding fluid outlets, wherein the fluid outlets are arranged opposite the fluid inlet, and the buffer cavities and the discharge channels are respectively parallel to the fluid jet array.