US 11,991,859 B2
Apparatus for direct contact heat pipe
Chin-Chung Wu, Taipei (TW); Chun-Han Lin, Yunlin County (TW); Che-Jung Chang, Taipei (TW); and Yueh Ching Lu, Taipei (TW)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by Dell Products L.P., Round Rock, TX (US)
Filed on Jul. 13, 2022, as Appl. No. 17/812,193.
Prior Publication US 2024/0023280 A1, Jan. 18, 2024
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20336 (2013.01) [G06F 1/206 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a heat pipe, the heat pipe including:
a first portion residing in a first plane;
a second portion residing in the first plane;
a third portion positioned between the first portion and the second portion, the third portion residing in a second plane spaced-apart from the first plane;
a base plate including an opening;
a clip plate, including:
a first region;
a second region; and
a third region positioned between the first and the second regions;
wherein the third portion of the heat pipe is positioned within the opening, and
wherein the clip plate is coupled to the base plate such that i) the third region of the clip plate is in superimposition with the third portion of the heat pipe and ii) third region of the clip plate resides in the first plane.