| CPC H05K 7/203 (2013.01) [H05K 7/20127 (2013.01); H05K 7/20318 (2013.01); H05K 7/20818 (2013.01)] | 10 Claims |
|
1. A housing and cooling system for computer hardware, the system comprising:
an infrastructure module configured for housing computer hardware, equipped with either or both of a convective air cooling system and an arrangement of metal plates connected by one or more conduits for carrying liquid for cooling computer equipment housed by the infrastructure module, and housing a programmable logic controller (“PLC”), the either or both of the convective air cooling system and the arrangement of metal plates having a first cooling capacity; and
a payload module including an immersion cooling system governed by the PLC and located outside of the infrastructure module, the immersion cooling system having a second cooling capacity higher than the first cooling capacity,
wherein the infrastructure module includes one or more racks of computing hardware having a first power consumption level,
wherein the payload module includes computing hardware having a second power consumption level, the second power consumption level being greater than the first power consumption level, and
wherein the infrastructure module includes an infrastructure bus bar and the payload module includes a payload bus bar that is electrically connected to the infrastructure bus bar.
|