US 11,991,856 B2
Liquid submersion cooled electronic systems
Rick Tufty, Rochester, MN (US); and Steve Shafer, Rochester, MN (US)
Assigned to LiquidCool Solutions, Inc., Rochester, MN (US)
Filed by LiquidCool Solutions, Inc., Rochester, MN (US)
Filed on May 7, 2021, as Appl. No. 17/314,666.
Application 17/314,666 is a continuation of application No. 16/222,429, filed on Dec. 17, 2018, granted, now 11,032,939.
Application 16/222,429 is a continuation in part of application No. 14/867,541, filed on Sep. 28, 2015, granted, now 10,271,456.
Claims priority of provisional application 62/056,150, filed on Sep. 26, 2014.
Prior Publication US 2021/0368650 A1, Nov. 25, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01); H05K 5/06 (2006.01)
CPC H05K 7/20236 (2013.01) [G06F 1/20 (2013.01); H05K 5/067 (2013.01); H05K 7/20263 (2013.01); H05K 7/20272 (2013.01); H05K 7/20281 (2013.01); H05K 7/20772 (2013.01); G06F 2200/201 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A method of cooling a heat generating electronic computer component of a computing system, comprising:
submerging the heat generating electronic computer component, that is mounted on an upper surface of a circuit board, of the computing system in a single-phase dielectric cooling liquid contained in an interior space defined within an enclosure of the computing system so that the heat generating electronic computer component is in direct contact with the single-phase dielectric cooling liquid; the enclosure includes a first wall and a second wall opposite the first wall that are parallel to the circuit board, a first side wall, a second side wall, a first end wall and a second end wall;
after contacting the heat generating electronic computer component, circulating the single-phase dielectric cooling liquid through a heat exchanger to cool the single-phase dielectric cooling liquid without circulating the single-phase dielectric cooling liquid to an external heat exchanger, wherein the single-phase dielectric cooling liquid is circulated by a pump disposed within the interior space of the enclosure and disposed within the single-phase dielectric cooling liquid and the pump is not mounted on the circuit board; and
directing a return flow of the single-phase dielectric cooling liquid, after being cooled in the heat exchanger, into a manifold within the enclosure that does not overlap the upper surface and that is not affixed to the circuit board, and thereafter from the manifold directly onto the submerged heat generating electronic computer component or directly onto a heat sink that is fixed to the submerged heat generating electronic computer component.