US 11,991,837 B2
Circuit board and manufacturing method thereof
Ke-Chien Li, Taoyuan (TW); Chun-Hung Kuo, Taoyuan (TW); and Chih-Chun Liang, Taoyuan (TW)
Assigned to Unimicron Technology Corp., Taoyuan (TW)
Filed by Unimicron Technology Corp., Taoyuan (TW)
Filed on Mar. 1, 2022, as Appl. No. 17/683,371.
Claims priority of provisional application 63/213,690, filed on Jun. 22, 2021.
Claims priority of application No. 111102876 (TW), filed on Jan. 24, 2022.
Prior Publication US 2022/0408567 A1, Dec. 22, 2022
Int. Cl. H05K 3/46 (2006.01); H05K 1/11 (2006.01)
CPC H05K 3/4644 (2013.01) [H05K 1/115 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A circuit board, comprising:
a substrate;
a build-up circuit structure, disposed on the substrate and comprising:
at least one inner circuit;
at least one dielectric layer, disposed on the at least one inner circuit;
an outer circuit, disposed on the at least one dielectric layer; and
a plurality of conductive vias, penetrating the at least one dielectric layer and electrically connecting the at least one inner circuit and the outer circuit;
a graphene oxide layer and a graphene layer, disposed on the build-up circuit structure at an interval, wherein the graphene oxide layer is disposed in correspondence to the at least one dielectric layer, and the graphene layer is disposed in correspondence to the outer circuit; and
an insulating material layer, disposed on the graphene oxide layer and the graphene layer, wherein the insulating material layer has an opening, and the opening exposes the graphene layer.