CPC H05K 3/4007 (2013.01) [H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 3/0041 (2013.01); H05K 3/048 (2013.01); H05K 3/064 (2013.01); H05K 3/067 (2013.01); H05K 3/1216 (2013.01); H05K 3/1225 (2013.01); H01L 21/0331 (2013.01); H05K 1/0393 (2013.01); H05K 3/1283 (2013.01); H05K 3/3463 (2013.01); H05K 2203/043 (2013.01); H05K 2203/087 (2013.01); H05K 2203/166 (2013.01)] | 16 Claims |
1. An electrical device, comprising:
a softening polymer layer;
an electrode layer on a surface of the softening polymer layer; and
a cover polymer layer on the surface of the softening polymer layer, wherein:
an opening in the polymer cover layer is filled with a reflowed solder,
one end of the reflowed solder, located inside the opening, contacts a contact pad site portion of the electrode layer,
another end of the reflowed solder contacts an electrical connector electrode of the device; and
the cover polymer layer is composed of a second softening polymer on the surface of the softening polymer layer, wherein an opening in the second softening polymer cover layer exposes a portion of a surface of the electrode layer, and wherein the softening polymer layer and the cover layer of the second softening polymer are composed of a softening polymer having a Young's modulus that decreases by more than 1 order of magnitude within a 30° C. temperature increase.
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