US 11,991,834 B2
Pressing method of a flexible printed circuit board and a substrate
Jae Uk Cho, Yongin-si (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Oct. 26, 2020, as Appl. No. 17/079,900.
Application 17/079,900 is a division of application No. 15/688,381, filed on Aug. 28, 2017, granted, now 10,849,237.
Claims priority of application No. 10-2016-0142265 (KR), filed on Oct. 28, 2016.
Prior Publication US 2021/0045253 A1, Feb. 11, 2021
Int. Cl. H05K 3/32 (2006.01); B21J 9/02 (2006.01); B21J 9/08 (2006.01); H05K 1/18 (2006.01)
CPC H05K 3/325 (2013.01) [B21J 9/022 (2013.01); B21J 9/08 (2013.01); H05K 1/189 (2013.01); H05K 3/32 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10598 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/1105 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A pressing method operatively associated with a press apparatus, the method comprising:
providing a first substrate connected with a flexible printed circuit board at a first connection portion of the flexible printed circuit board onto a first stage portion of the press apparatus;
providing a second substrate onto a second stage portion of the press apparatus;
arranging pad electrodes of the flexible printed circuit board on pad electrodes of the second substrate;
firstly pressing a pad electrode-free area of the flexible printed circuit board, the pad electrode-free area being between the first connection portion of the flexible printed circuit board and the pad electrodes of the flexible printed circuit board; and
subsequently to the firstly pressing of the pad electrode-free area, secondly pressing the pad electrodes of the flexible printed circuit board and the pad electrodes of the second substrate while pressing of the pad electrode-free area of the firstly pressing.