US 11,991,831 B2
Component mounting device and manufacturing method for mounting substrate
Hideaki Katou, Fukuoka (JP); Naoki Azuma, Fukuoka (JP); Koji Sakurai, Fukuoka (JP); and Masanori Ikeda, Osaka (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 17/755,223
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
PCT Filed Aug. 4, 2020, PCT No. PCT/JP2020/029755
§ 371(c)(1), (2) Date Apr. 24, 2022,
PCT Pub. No. WO2021/084831, PCT Pub. Date May 6, 2021.
Claims priority of application No. 2019-196074 (JP), filed on Oct. 29, 2019.
Prior Publication US 2022/0386517 A1, Dec. 1, 2022
Int. Cl. H05K 13/04 (2006.01); H05K 13/00 (2006.01)
CPC H05K 13/0015 (2013.01) [H05K 13/04 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A component mounting device configured to mount, on a substrate, a light emitting element having a light emitter, the component mounting device comprising:
a storage unit that stores data including a holding position correction value set for each type of light emitting elements;
a component supply mechanism that supplies the light emitting element;
a recognition unit that recognizes a position of the light emitter;
a component mounting mechanism that holds the light emitting element supplied from the component supply mechanism and mounts the light emitting element on the substrate; and
a holding position determination unit that calculates, utilizing the recognized position of the light emitter and the holding position correction value, a position to be held by the component mounting mechanism, wherein the holding position correction value is set for each type of light emitting elements and determines the calculated position as a holding position of the light emitting element.